SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guid
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| Listing | FixedPriceItem · Completed |
| Start time | 2024-09-06T03:07:10.000Z |
| End time | 2024-12-17T03:08:51.000Z |
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| Return shipping will be paid by | Buyer |
| All returns accepted | Returns Accepted |
| Item must be returned within | 30 Days |
| Refund will be given as | Money Back |
| ISBN-13 | 9781119045939 |
| Book Title | SiP System-in-Package Design and Simulation |
| Number of Pages | 400 Pages |
| Publication Name | Sip System-In-Package Design and Simulation : Mentor Ee Flow Advanced Design Guide |
| Language | English |
| Publisher | Wiley & Sons, Incorporated, John |
| Item Height | 1.2 in |
| Publication Year | 2017 |
| Subject | Electronics / Circuits / Integrated, Electronics / Microelectronics, Electronics / Circuits / General |
| Type | Textbook |
| Item Weight | 33.7 Oz |
| Subject Area | Technology & Engineering |
| Author | Suny Li (Li Yang) |
| Item Length | 9.8 in |
| Item Width | 6.6 in |
| Format | Hardcover |
SiP System-in-Package Design and Simulation by Suny Li Estimated delivery 3-12 business days Format Hardcover Condition
Brand New Description An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Publisher Description An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. Author Biography Mr. Suny Li (Li Yang) is a SiP/PCB Technical Specialist in China; he now works in AcconSys Technology Co. Ltd, (a Mentor Authorized Distributor for China). Suny has guided and consulted on dozens of SiP projects in China, accumulating plentiful experience in SiP design and simulation. Suny has 10 years experience in and knowledge of Application Engineer for Mentor, especially in SiP/PCB design and simulation. Before this, Suny worked in the Chinese Academy of Science and SIEMENS for several years. He has more than seven years experience in hardware design (HW system design, PCB layout, high–speed signal integrity, power integrity, EMI, etc.). In the course of his work, Suny has published papers and acquired four patents, and he continues with this work. Suny is a senior member of the Chinese Institute of Electronics (CIE) and a member of the IEEE. Suny graduated from Beijing University of Aeronautics & Astronautics (BUAA) in 2000, receiving Masters and Bachelors degrees in Science and Technology of Aeronautics & Astronautics. Details ISBN 1119045932 ISBN-13 9781119045939 Title SiP System-in-Package Design and Simulation Author Suny Li Format Hardcover Year 2017 Pages 400 Publisher John Wiley & Sons Inc GE_Item_ID:117067609; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys